The perfect integration of DEA bridge CMM technology and the Leitz LSP-X1c scanning sensor makes DEA MICRA a multifunctional measurement tool which is ideal both for single point probing of prismatic parts and high-speed continuous scanning of profiles and complex geometries.

In addition, the DEA MICRA has a small footprint and can be transported quickly and flexibly. The light-alloy frame specially designed for added rigidity, combined with the exclusive portal configuration of the X traverse utilizing the TRICISION® architecture, optimizes the relationship between rigidity and weight. This way, the highest possible accuracy and outstanding long-term stability are achieved.

Regardless whether using CAD-based construction information or if measuring complex, difficult geometries: the DEA MICRA – armed with the PC-DMIS or QUINDOS software – represents the state-of-the-art quality inspection for small-part measurement.

The DEA MICRA is particularly suitable for the following applications:

• Precision engineering and the optical industry
• Electronics and telecommunication
• Medical technology engineering
• Watchmaking
• Powertrain

• Highly rigid weight-optimized frame, patented TRICISION® architecture
• Measurement volume 400 x 500 x 300 mm
• High-precision Leitz LSP-X1c scanning probe system
• Small footprint and compact
• Easy to transport
• High accuracy